An inventor claims to have created a silicon chip whose surface temperature is no more than 60 °C. The silicon chip has dimensions of 5 mm on each side with a 1 mm thickness, and is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.225 W. The top surface of the chip is exposed to a coolant whose temperature is 20 °C. The heat transfer coefficient for convection (h) between the coolant and chip is 105 W/m2•K. Evaluate the inventor's claim using the following:
a.) First Law Energy Balance, assuming that the heat transfer by conduction between the chip and substrate is negligible.
b.) Second Law Energy Balance: Calculate entropy generation.
In your analysis section, be sure to comment on what is the main source of entropy generation in this system.
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1 comment:
Brilliant post. I think there is a gap in the market for this type of equipment, but this company are really filling the brief.
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